AltaVel


AltaVel Specifications and Performance

Parameter Specifications
Insertion Loss <0.8 dB to 25Ghz (interconnect only)*
Data Rate FDR - 14Gb/s, EDR - 26Gb/s & PCIe Gen4 - 16Gb/s
Impedance 85 or 100 ohm differential impedance;
50 or 75 ohm single-ended impedance
Contact rating 3 amp max, at ambient with 30° rise
Operating Temperature -55˚C to +125˚C
Minimum Contact Wipe 1 mm (0.039") typical
Contact Mating Force 40 grams typical
Insulation Resistance 5,000 megaohms minimum @ 500 VDC
DC Resistance (mated pair) 8.5 milliohm @ 8mm stack height
Durability min 1,000 cycles and up to 10,000 mate/demate cycles
Sinusoidal Vibration 20g (EIA-364-28, condition IV)
Shock 50 g (EIA-364-27, condition E)
Operating Voltage 200 V, RMS, 60 Hz typical
*Simulated data only
Materials & Finishes
Pin Contacts BeCu per ASTM B194, plated 30 - 50 μin gold over100 μin nickel minimum in mated contact area, 5 μin gold over 100 μin nickel on tailsp
Socket Contacts BeCu per ASTM B194, plated 30 - 50 μin gold over100 μin nickel minimum in mated contact area, 5μin gold over 100 μin nickel on tails
Contact Finish Localized gold finish per ASTM B488 over nickel per ASTM B689 Type 1
Molded Insulators 30% glass-filled LCP per ASTM D5138
Hardware Stainless steel
Shell (ruggedized) Aluminum alloy
Finish (ruggedized) Nickel plated
RoHS Compliant: Yes
Solderable: Lead or lead-free

Insertion and Return Loss (Simulated)

Insertion and Return Loss (Simulated)

Crosstalk (Simulated)

Crosstalk (Simulated)

Test Set Up - Differential Simulation included Footprint and Break-out Region + 6mm

Test Set Up -
Differential Simulation included Footprint and Break-out Region + 6mm

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